The copper foil board base paper is the fundamental material to product the paper of printing line board, and also is a kind of higher degree special industrial paper.
覆铜箔层压板原纸是生产印刷线路板用全纸基覆铜箔层压板的基础材料,是一种生产难度较高的特种工业用纸。
The capability of water-absorption is the essential technical property index to the copper foil board base paper.
吸水性是覆铜箔层压板原纸的主要技术性能指标,作者在文中对影响覆铜箔层压板原纸吸水性的主要因素进行了分析,并结合生产实际提出了控制措施及其打浆的主要流程,对该产品的生产有一定的借鉴意义。
The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper.
介绍了覆铜箔板纸的用途,覆铜箔板的制造过程和应用。
It has been demonstrated that the recycled particle from printed circuit board waste can be used as a filler aod reinforcement in thermoplastic PP, PE, PVC and thermosetting BMC.
本文介绍了覆铜箔板废料的回收处理路线,研究了其回收粒料对热塑性PP、PE、PVC和热固性 BMC填充和增强的作用。
metal core copper-clad laminate
金属芯覆铜箔层压板
General rules for copper-clad laminated sheets for printed circuits
GB/T4721-1992印制电路用覆铜箔层压板通用规则
Test methods for copper-clad laminated sheets for printed circuits
GB/T4722-1992印制电路用覆铜箔层压板试验方法
The Synthesis and Properties of Epoxy Resins Used in Copper Clad Laminates;
覆铜箔层压板专用环氧树脂的合成与性能
New Generation High Heat Resistance,High Modulus and Low CTE Copper Clad Laminates
新一代高耐热性、高模量、低CTE覆铜箔层压板材料
Phenolic cellulose paper copper-clad laminated sheets for printed circuits
GB/T4723-1992印制电路用覆铜箔酚醛纸层压板
Epoxide cellulose paper copper-clad laminated sheets for printed circuits
GB/T4724-1992印制电路用覆铜箔环氧纸层压板
Epoxide woven glass fabric copper-clad laminated sheets for printed circuits
GB/T4725-1992印制电路用覆铜箔环氧玻璃布层压板
" Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, For use in the fabrication of multilayer printed boards"
GB/T12630-1990一般用途的薄覆铜箔环氧玻璃布层压板(制造多层印制板用)
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
GB/T16315-1996印制电路用限定燃烧性的覆铜箔聚酰亚胺玻璃布层压板
This paper introduces a new technics of producing light colour phenolic paper copper-clad laminate and summarizes the main effects on the laminates colour.
本文介绍了一种生产浅色覆铜箔酚醛纸层压板的工艺，总结了影响层压板颜色的因素。
Application and Development of HDI Multi-layer Laminated Copper Foil Production Technology
HDI多层板覆铜箔板生产技术的应用与开发
Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
GB/T12629-1990限定燃烧性的薄覆铜箔环氧玻璃布层压板(制造多层印制板用)
epoxide woven glass fabric copper-clad laminates
环氧玻璃布基覆铜箔板
ployester woven glass fabric copper-clad laminates
聚酯玻璃布覆铜箔板
UV Blocking copper-clad laminates
紫外线阻挡型覆铜箔板
Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
GB/T16317-1996多层印制电路用限定燃烧性的薄覆铜箔聚酰亚胺玻璃布层压板
epoxide synthetic fiber fabric copper-clad laminates
环氧合成纤维布覆铜箔板
