The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper.
介绍了覆铜箔板纸的用途,覆铜箔板的制造过程和应用。
It has been demonstrated that the recycled particle from printed circuit board waste can be used as a filler aod reinforcement in thermoplastic PP, PE, PVC and thermosetting BMC.
本文介绍了覆铜箔板废料的回收处理路线,研究了其回收粒料对热塑性PP、PE、PVC和热固性 BMC填充和增强的作用。
It was confirmed that convention fabrication process for FR-5 laminate was applicable to copper-clad laminates fabrication for the epocy-silicon hybrid resin.
概述了基于新概念的环氧-硅复合树脂的开发,并证实了传统FR-5基材的制造工艺可以适用于环氧-硅复合树脂的覆铜箔板制造。
This paper describes the requirment,characteristic and application of low thermal expansion high elastic modulus glass epoxy copper-clad laminat
概述了低热膨高弹性模量覆铜箔板的必要性、特征和用途。
The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper.
介绍了覆铜箔板纸的用途,覆铜箔板的制造过程和应用。
UV Blocking copper-clad laminates
紫外线阻挡型覆铜箔板
epoxide woven glass fabric copper-clad laminates
环氧玻璃布基覆铜箔板
ployester woven glass fabric copper-clad laminates
聚酯玻璃布覆铜箔板
metal core copper-clad laminate
金属芯覆铜箔层压板
epoxide synthetic fiber fabric copper-clad laminates
环氧合成纤维布覆铜箔板
polyimide woven glass fabric copper-clad laminates
聚酰亚胺玻璃布覆铜箔板
"epoxide cellulose paper core, glass cloth surfaces copper-clad laminates"
环氧玻璃布纸复合覆铜箔板
teflon/fiber glass copper-clad laminates
聚四乙烯玻璃纤维覆铜箔板
epoxide non woven/woven glass reinforced copper-clad laminates
环氧玻璃布玻璃纤维复合覆铜箔板
It screens out lethal ultraviolet and X-rays from the sun.
它阻挡了来自太阳的致命的紫外线和x射线。
The suitable protection may prevent the ultraviolet ray effectively, protects your flesh.
适当的防护可有效阻挡紫外线，保护您的肌肤。
The ozone layer blocks much of the sun's dangerous ultraviolet radiation.
臭氧屋阻挡了阳光中大量有害的紫外线辐射。
Application and Development of HDI Multi-layer Laminated Copper Foil Production Technology
HDI多层板覆铜箔板生产技术的应用与开发
The Synthesis of Phosphorous/Nitrogen-Containing Intumescent Flame Retardants and Their Application in FCCL
挠性覆铜板用磷-氮系膨胀型阻燃剂的合成研究
Bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
双马来酰亚胺三嗪环氧玻璃布覆铜箔板
Phenolic cellulose paper copper-clad laminated sheets for printed circuits
GB/T4723-1992印制电路用覆铜箔酚醛纸层压板
General rules for copper-clad laminated sheets for printed circuits
GB/T4721-1992印制电路用覆铜箔层压板通用规则
Epoxide cellulose paper copper-clad laminated sheets for printed circuits
GB/T4724-1992印制电路用覆铜箔环氧纸层压板
