Study on modified epoxy resin-encapsulating materials
改性环氧树脂灌封材料的研制
Milled glass fiber (MG)/polyurethane (PU)/epoxy resin (EP) encapsulating material was prepared by vacuum priming.
采用真空灌注工艺,制备磨碎玻璃纤维(MG)／聚氨酯(PU)／环氧(EP)灌封材料,并对其力学性能和微观结构进行研究。
Epoxy resin/nano-silica encapsulating materials were obtained from in situ polymerization, and microstructure and properties of the materials were investigated by transmission electron microscopy(TEM),scanning electron microscopy(SEM) and differential scanning calorimetry(DSC).
采用原位聚合法制备了环氧树脂/纳米S iO2灌封材料。
Properties of Epoxy Encapsulating Materials;
环氧树脂灌封材料性能研究
Study on synthesis and mechanics performance of encapsulating materials based on nano-SiO_2/epoxy resin
纳米SiO_2/环氧树脂灌封材料的制备和力学性能研究
This paper mainly described the research on rheological property,high thermal stability,flame retardant,the influence of catalyst and insulating heat conduction of organic silicon encapsulating materials,which greatly apply on electronic equipment and large scale integrated circuit and so forth.
本文主要综述了国内外用于电子元器件、大规模集成电路等高科技领域的有机硅灌封材料在流动、耐高温、阻燃和绝缘导热等方面的性能以及催化剂对灌封材料的影响的研究应用进展。
Preparation of Two-part Addition Cure Potting Silicone Rubber
双组分加成型硅橡胶电子灌封料的制备
Study on Single Component Additional Liquid Silicone Potting Material in Electronics Industry;
电子工业用单组分加成型液体硅橡胶灌封料的研究
Research on Vacuum Resin Dosing Technology Applying in Electronic Body and Special Material of Air-To-Air Missile;
空空导弹电子本体特种料真空树脂灌封关键技术的研究
Effect of Grafted Particles PGMA/Al_2O_3 on Toughness and Reinforce of Encapsulating Materials of Epoxy Resin
接枝微粒PGMA/Al_2O_3对环氧树脂电子灌封材料的增强增韧作用
sealing compound
电缆膏； 封口膏， 密封剂， 油灰， 腻子； 电瓶封口填料； 密封接合物
Application of Silicone to Epoxy Encapsulating Materals and Potting Compound
有机硅在环氧包封料、灌封料中的应用
Encapsulation Technology of Electronic Circuit for High Overload Test
高过载测试中的电子线路灌封技术研究
The FEA Simulation of Moisture Diffusion in Electronic Packages;
塑料电子封装件中湿扩散有限元分析
Electron-induced Damage of CMOS with Shielded Packages
屏蔽材料封装CMOS器件的电子辐照损伤
Research Progress of Diamond-Cu Composite Material for Electronic Packaging
电子封装材料用金刚石/铜复合材料的研究进展
General specification for electronic components plastic packaging equipments
GB/T13947-1992电子元器件塑料封装设备通用技术条件
Development of Lead Free Solder and Its Interfacial Issues in Electronics Packaging;
电子封装互连无铅钎料及其界面问题研究
The Research on Properties of SiC_p/Al Composite for Electronic Packaging;
电子封装SiC_p/Al 复合材料性能及影响因素研究
Fabrication and Properties of SiC_p/Al Electrical Packaging Composites by Spark Plasma Sintering;
SiC_p/Al电子封装复合材料的SPS烧结及性能研究
Thermophysical Properties of Aluminum Infiltrated Silicon Carbide for Electronic Packaging;
铝渗碳化硅电子封装材料的热物理性能
Study on Electronic Encapsulation Material Basied on Benzoxazine Resin;
苯并噁嗪树脂在电子封装材料中的应用研究
The Structure and Properties of Al/SiCp Composites Preparated by Pressureless Infiltration for Electronic Packaging;
无压浸渗制备Al/SiCp电子封装材料的结构与性能
Investigation on Al/SiCp Electronic Packaging Materials Fabricated by Gas Pressure Infiltrating Processes;
气压浸渗法制备Al/SiCp电子封装材料的研究
