The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper.
介绍了覆铜箔板纸的用途,覆铜箔板的制造过程和应用。
It has been demonstrated that the recycled particle from printed circuit board waste can be used as a filler aod reinforcement in thermoplastic PP, PE, PVC and thermosetting BMC.
本文介绍了覆铜箔板废料的回收处理路线,研究了其回收粒料对热塑性PP、PE、PVC和热固性 BMC填充和增强的作用。
It was confirmed that convention fabrication process for FR-5 laminate was applicable to copper-clad laminates fabrication for the epocy-silicon hybrid resin.
概述了基于新概念的环氧-硅复合树脂的开发,并证实了传统FR-5基材的制造工艺可以适用于环氧-硅复合树脂的覆铜箔板制造。
This paper describes the requirment,characteristic and application of low thermal expansion high elastic modulus glass epoxy copper-clad laminat
概述了低热膨高弹性模量覆铜箔板的必要性、特征和用途。
The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper.
介绍了覆铜箔板纸的用途,覆铜箔板的制造过程和应用。
Research on On-Line Detection System of Copper Clad Laminates Defects Base on Machine Vision Technology;
基于机器视觉技术的铜箔基板缺陷在线检测系统研究
epoxide woven glass fabric copper-clad laminates
环氧玻璃布基覆铜箔板
ployester woven glass fabric copper-clad laminates
聚酯玻璃布覆铜箔板
UV Blocking copper-clad laminates
紫外线阻挡型覆铜箔板
epoxide synthetic fiber fabric copper-clad laminates
环氧合成纤维布覆铜箔板
polyimide woven glass fabric copper-clad laminates
聚酰亚胺玻璃布覆铜箔板
"epoxide cellulose paper core, glass cloth surfaces copper-clad laminates"
环氧玻璃布纸复合覆铜箔板
teflon/fiber glass copper-clad laminates
聚四乙烯玻璃纤维覆铜箔板
epoxide non woven/woven glass reinforced copper-clad laminates
环氧玻璃布玻璃纤维复合覆铜箔板
Application and Development of HDI Multi-layer Laminated Copper Foil Production Technology
HDI多层板覆铜箔板生产技术的应用与开发
Bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
双马来酰亚胺三嗪环氧玻璃布覆铜箔板
The Challenge of Signal Transmission in High Frequency and High Speed Digitization(2)--The Requirements for CCL
信号传输高频化和高速数字化对PCB的挑战(2)——对覆铜箔板(CCL)的要求
metal core copper-clad laminate
金属芯覆铜箔层压板
Phenolic cellulose paper copper-clad laminated sheets for printed circuits
GB/T4723-1992印制电路用覆铜箔酚醛纸层压板
General rules for copper-clad laminated sheets for printed circuits
GB/T4721-1992印制电路用覆铜箔层压板通用规则
Epoxide cellulose paper copper-clad laminated sheets for printed circuits
GB/T4724-1992印制电路用覆铜箔环氧纸层压板
Test methods for copper-clad laminated sheets for printed circuits
GB/T4722-1992印制电路用覆铜箔层压板试验方法
Epoxide woven glass fabric copper-clad laminated sheets for printed circuits
GB/T4725-1992印制电路用覆铜箔环氧玻璃布层压板
The Synthesis and Properties of Epoxy Resins Used in Copper Clad Laminates;
覆铜箔层压板专用环氧树脂的合成与性能
