In this paper, an electric device is proposed to measure contact stress on the sealing surface of sealing elements.
该装置能在模拟密封元件工作环境(工作介质及介质压力)的情况下,直接准确地测量出密封元件密封面的接触应力。
However, service life of seal elements has become the problem of water hydraulic single prop used in fact industry.
论文对水介质密封机理、水介质密封件的摩擦磨损机理、水介质密封结构、水介质密封材料及水介质单体液压支柱的密封元件进行了研究。
Study on Seal Element of Water Hydraulic Single Prop;
水介质单体液压支柱密封元件的研究
Applications of Seals in Hydraulic and Pneumatic Equipment of Hot-rolling Mill
热连轧机液压气动设备中密封元件的应用
Study on Plastic and Fatigue Behavior of Reactor Materials and Sealing Element;
反应堆材料与密封元件的塑性与疲劳行为研究
Research on the Test Methods and Technics of Orient Gas & Oil Combination s Multiform Seals;
面向气油组合的多品种密封元件试验方法与工艺的研究
encapsulated fuel unit
加密封套的燃料元件
Finite Element Analysis on Rubber Sealing Y-ring in the Condition of Static Seal
静密封条件下Y形橡胶密封圈有限元分析
Effect of Hydrogen on the Reliability of Microelectronic Devices
氢对金属封装密封元器件可靠性的影响
Design and application of Ω-profiled stern shaft sealing
船舶尾轴密封Ω型弹性元件的设计与应用
In relation to an integrated circuit;a term that indicates small element size and high packing density.
集成电路技术中的一种修饰术语，表示元件体积小而且封装密度高。
Analysis of Fem and Sealing Characteristic in the Key Components of HVD
液体粘性调速离合器关键部件有限元及其密封特性分析
Finite Element Analyse of the Distortion of Sealing Ring of Spiral Groove Gas Face Seals;
螺旋槽气体端面密封密封环变形有限元分析
Study on Protel DXP Packaging Components Library
Protel DXP元件封装库的研究
The software and hardware design of remotely controlled sealing and unsealing of plugging module
封堵模块遥控密封和解封的软硬件设计研究
Sealing ring is fitted on pump body, while impeller sealing ring is an optional part.
设有泵体密封环，而叶轮密封环为可选用件。
Research on Assembly Reliability and Sealing Properties of the Bearing Sealed Ring;
轴承密封件安装稳定性与密封特性研究
Analysis of Seal Rings Nonlinear Distortion and Seal Capability of Bearing;
密封件非线性变形与轴承密封性能研究
Finite Element Analysis on the Sealing Structure of the Bulkhead for a Columniform Dewar
柱形杜瓦瓶端盖密封结构有限元分析
The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays.
减少元件和电路的几何尺寸，以达到增加电路的封装密度、减少功耗和减小信号传播延迟的目的。
