High-performance CCL include PI CCL,microwave ccl and Pb-free FR-4 CCL.
"特种覆铜板"主要是指聚酰亚胺玻璃布覆铜板、微波电路用覆铜板及适应无铅化要求的FR-4覆铜板。
The properties of bismaleimide of polyimide CCL are reviewed in this paper.
论文根据双马来酰亚胺的性能特点,以适当的方法成功地用环氧改性了双马树脂,并配合不同的增强材料研制出三种新型聚酰亚胺覆铜板,它们在耐热性、耐高频性、热膨胀性等方面都比FR-4优异,其它性能与FR-4相当。
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
GB/T16315-1996印制电路用限定燃烧性的覆铜箔聚酰亚胺玻璃布层压板
Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
GB/T16317-1996多层印制电路用限定燃烧性的薄覆铜箔聚酰亚胺玻璃布层压板
polyimide woven glass fabric copper-clad laminates
聚酰亚胺玻璃布覆铜箔板
Bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
双马来酰亚胺三嗪环氧玻璃布覆铜箔板
ployester woven glass fabric copper-clad laminates
聚酯玻璃布覆铜箔板
Epoxide woven glass fabric copper-clad laminated sheets for printed circuits
GB/T4725-1992印制电路用覆铜箔环氧玻璃布层压板
epoxide woven glass fabric copper-clad laminates
环氧玻璃布基覆铜箔板
" Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, For use in the fabrication of multilayer printed boards"
GB/T12630-1990一般用途的薄覆铜箔环氧玻璃布层压板(制造多层印制板用)
epoxide non woven/woven glass reinforced copper-clad laminates
环氧玻璃布玻璃纤维复合覆铜箔板
teflon/fiber glass copper-clad laminates
聚四乙烯玻璃纤维覆铜箔板
"epoxide cellulose paper core, glass cloth surfaces copper-clad laminates"
环氧玻璃布纸复合覆铜箔板
Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
GB/T12629-1990限定燃烧性的薄覆铜箔环氧玻璃布层压板(制造多层印制板用)
Flexible copper-clad polyimide film for printed circuits
GB/T13555-1992印制电路用挠性覆铜箔聚酰亚胺薄膜
metal core copper-clad laminate
金属芯覆铜箔层压板
Development of Heat-Resistant Fiberglass Reinforced Polyimide Honeycomb
耐高温玻璃布/聚酰亚胺蜂窝的研制
polyamide-coated glass fibre
聚酰胺涂层的玻璃纤维
Synthesis and Applied Research on Polyimide Used for 2-Layer Double-side Flexible Copper Clad Laminate
二层法双面挠性覆铜板用热塑性聚酰亚胺的合成与应用研究
Phenolic cellulose paper copper-clad laminated sheets for printed circuits
GB/T4723-1992印制电路用覆铜箔酚醛纸层压板
