CdSe Detector Wafer Surface Treatment and Passivation Study;
CdSe探测器晶片表面处理和钝化研究
Free-pyro black LiNbO_3 and LiTaO_3 wafers were prepared successfully by chemical reduction at (700 °C) and 450 °C respectively under a mixed atmosphere of CO_2 and H_2.
采用化学还原工艺,在CO2与H2混合气氛下对LN和LT晶片分别进行700°C和450°C退火处理,成功地制备了LN和LT黑色晶片。
The wafer edge grinding technique of the semiconductor technology was discussed,and the feature was analyzed.
对半导体工艺中晶片的边缘磨削技术进行了论述,分析了晶片边缘磨削技术的特点,在此基础上,提出了一种高效、可靠的晶片边缘磨削方法。
Double-sided polishing process is a precise machining method for silicon wafers.
晶片在双面抛光加工过程中具有多向运动、受力复杂、表面材料微细去除的特征,晶片的运动和受力是影响双面抛光加工质量的主要因素。
Ultra precision-machining technology for crystal wafers;
晶片材料的超精密加工技术现状
The article directly introduced crystal wafer processing and other main parameters through testing diagrams,meanwhile four inch LiNbO3 wafer s reaching level of Ningxia Orient Tantalum Industry.
通过检测图片,直观地介绍了衡量晶片加工水平各主要参数的意义;同时,介绍了宁夏东方钽业4英寸LN(LiNbO3)晶片研发的进展,并和目前国外4英寸LN晶片加工水平进行了对比。
SiC platelets/C preform was infiltrated with liquid silicon to prepare reaction bonded silicon carbide(RBSC) materials.
以液Si浸渗SiC片晶和C的坯体制备了SiC片晶增韧反应烧结SiC陶瓷材料,讨论了SiC片晶的掺加分数及烧结温度对材料显微结构和力学性能的影响,并比较了所得材料与传统反应烧结材料的力学性能。
Advances in the development of ceramies toughened with whiskers, particles or platelets are reviewed with primary focus on toughening mechanism by crack bridging process-es (e.
讨论了用晶须、颗粒或片晶增韧陶瓷在断裂韧性和强度上的发展。
The microstructure and mechanical properties of in situ A12O3 platelet/Ce-TZP composites were studied.
研究了原位生长Ａｌ２Ｏ３片晶／Ｃｅ－ＴＺＰ复合材料的显微结构与力学性能。
form cobalt hydroxides were synthesized through a controlled crystallization process under the certain mixing intensity, Co 2+ concentration, pH value and the protect of the inert gas and the products was fine platelet powder with high purity and high crystallinity.
通过控制结晶法，在一定的搅拌强度、一定的Ｃｏ２＋ 浓度、一定的ｐＨ值和惰性气体保护的条件下合成出高纯度和高结晶度的β－Ｃｏ（ＯＨ）２ 的片晶细粉。
Monocrystalline germanium slices
GB/T15713-1995锗单晶片
multicrystal phased array scanning
相控阵多晶片电子扫描
strontium barium niobate pyroelectric crystal plate
铌酸锶钡热电晶片材料
Others tried stacking conventional 2-D chips on top of one another.
另外有人试著把二维晶片一片片堆叠起来。
To smooth the surface of a wafer or semiconductor crystal.
使晶片或半导体晶体的表面光滑的过程。
Hydrothermal Synthesis of the Mn_xZn_(1-x)O Crystal and the Crystal Sheet of Nano Boehmite;
水热法合成Mn_xZn_（1-x）O晶体和纳米薄水铝石晶片
EFFECT OF TWIN LAMELLAR THICKNESS ON THE FATIGUE PROPERTIES OF NANO-TWINNED Cu
孪晶片层厚度对纳米孪晶Cu疲劳性能的影响
The CBFS series is a3 terminal EMI Suppressor Filter based on multilayer chip capacitor technology.
CBF系列的晶片系以积层晶片电容科技为基础之三端子滤波器.
Research on Fabrication Technology of Bumps for Flip Chip
用于倒装芯片的晶片凸点制作工艺研究
Specification for establishing a wafer coordinate system
GB/T16596-1996确定晶片坐标系规范
Mechanical Test Wafer- A silicon wafer used for testing purposes.
机械测试晶圆片-用于测试的晶圆片。
plate form of wax crystals
石蜡结晶的片状结构
polycrystalline diamond compact bit
聚晶金刚石复合片钻头
Molten salt synthesis of platelet NaNbO_3 crystals
熔盐法合成片状NaNbO_3晶体
" Indium antimonide polycrystal, single crystals and as-cut slices"
GB/T11072-1989锑化铟多晶、单晶及切割片
Process Test Wafer- A wafer that can be used for processes as well as area cleanliness.
加工测试晶圆片-用于区域清洁过程中的晶圆片。
Ingot- A cylindrical solid made of polycrystalline or single crystal silicon from which wafers are cut.
晶锭-由多晶或单晶形成的圆柱体，晶圆片由此切割而成。
Monocrystalline silicon ascut slices and lapped slices
GB/T12965-1996硅单晶切割片和研磨片
