The plane structure with back bearing pressure and the design of no cavity flat package are the key of realizing the.
用MEMS技术设计的内径为2 mm的周边固支圆平膜片微型敏感元件具有高达数百kHz的固有频率,刚性键合及低桥阻确保了亚μs级的上升时间,背面承压的平面结构及无管腔齐平封装设计是高频响特性实现的关键。
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