COG chip size package是什么意思

用法例句

Research on the thermal stress and warpage of WLCSP device

晶圆尺寸级封装器件的热应力及翘曲变形

Influence of wire rolling process parameters on austenite grain size of high carbon steel;

高碳钢线材轧制工艺参数对晶粒尺寸的影响

Prediction of the flow behavior and grain size during forming for nickel alloy heavy forging;

镍基合金大锻件成形过程流变行为与晶粒尺寸预测

Modelling for grain size and flow stress of magnesium alloy based on BP neural network;

基于BP神经网络的镁合金晶粒尺寸及流变应力模型

The increase of crystallite size and notable changes of orientation factor for crystal planes during blow molding process reveale.

结果表明经过吹塑成型过程后,TPCC的熔融温度、结晶度均较TPC有所提高,DSC熔融半峰宽明显下降,微晶尺寸明显增大,同时晶面取向因子发生显著变化,表明成型过程中晶区尺寸增大,且晶体结构更均匀规整,赋予了输液瓶良好的性能。

The crystallite size, degree of crystallinity( X c) and thermal properties of the [poly(cyanoarylether PCE)] at various temperatures have been studied by using WAXD and DSC.

利用广角 X射线衍射 (WAXD)方法和示差扫描量热法 (DSC)研究了不同热处理温度时聚芳醚腈 (PCE)的微晶尺寸、结晶度及热性能的变化。

The resultsshowed that after the treatment of cellulose with L-NH3, the lateral order distribution,crystallinity, crystallite size and lattice form of cellulose were dramatically changed.

结果表明，液氮处理后纤维素的侧序分布、结晶度、微晶尺寸、晶格形态都发生深刻的变化。

Determination of crystallite size and strain by X-ray powder

晶粒尺寸和应变的X射线粉末衍射法测定

The effects of the amount of Gd~ 3+ -doping and calcination temperature on the photocatalytic activity for photocatalytic degradation of methylene blue (MB) in aqueous solution, phase structure, crystallite size, surface texture properties of the nanopowders were investigated,and t.

研究了Gd3+掺杂量和焙烧温度对样品光催化降解亚甲基蓝的活性、相结构、晶粒尺寸和表面织构特性的影响,并结合表面光电特性和表面组成等探讨了Gd3+掺杂对纳米TiO2的光催化活性的影响机制。

The effects of pHinitial value, hydrothermal temperature and hydrothermal time on the morphology, crystal phase and crystallite size of TiO2 powder were investigated.

研究了反应初始pH值、水热反应温度和水热反应时间对TiO2形貌、物相和晶粒尺寸的影响。

The mechanical properties,spherulite size,melting point and crystallinity of the anhydrite/PP composites and the anhydrite modified by modifer/PP composites were studied.

研究了硬石膏及其表面改性对聚丙烯(PP)复合材料的力学性能、球晶尺寸、熔点和结晶度的影响。

At the same time,MB could decrease the spherulite size and the crystallization degree of polypropylene.

结果表明,成核剂MB较好地改善了聚丙烯的力学性能以及熔体流动性能,降低了聚丙烯球晶尺寸。

The morphologies of nonisothermal crystallized isotactic polypropylene (IPP)and added 25 nucleating agents samples have been studied by PLM and SEM The effect of nucleating agents and cooling rates (A) on spherulite size (d) has been researched.

研究了ＩＰＰ及其加２５种成核剂时的非等温结晶形态，考查了成核剂和线性降温速率α对球晶尺寸ｄ的影响。

Research on the thermal stress and warpage of WLCSP device

晶圆尺寸级封装器件的热应力及翘曲变形

Reliability of SOP Component Solder Joint

小尺寸封装(SOP)器件焊点可靠性研究

Packaging--Dimensions of cylinder transport package

GB/T13201-1997圆柱体运输包装尺寸系列

Thermal Stress Analysis of Stacking Chip Scale Package under Power Load;

功率载荷下叠层芯片尺寸封装热应力分析

A Study on Thermal Stress and Invalidation for Chip Scale Package;

芯片尺寸封装（CSP）的热应力及热失效分析研究

SIZE EFFECT OF MECHANICAL BEHAVIOR OF MINIATURE SOLDER JOINT INTERCONNECTIONS IN ELECTRONIC PACKAGING

电子封装微互连焊点力学行为的尺寸效应

Woodruff keys--Types and dimensions

GB/T1099-1979半圆键型式尺寸

sizematic internal grinder

自动定尺寸内圆磨床

Study on Al Pad Contamination Sources During Wafer Fabrication,Shipping and Assembly

晶圆制造、运输、封装过程中Al焊垫污染源的研究

Eventually closed all the screw compressor assembly drawings, plans and dimensions of all the main components map.

最终形成全封闭螺杆压缩机总装配图、形尺寸图和各主零件图。

Pressureless Infiltration of SiCp/Al Electronic Packaging Materials with Particles of Bimodal Size Distribution;

无压浸渗制备双尺寸颗粒SiCp/Al电子封装材料的研究

Finite-Element Simulation and Solder Joint Life Predictions for Chip Scale Ball Grid Array Size Package;

球栅阵列尺寸封装的有限元法模拟及焊点的寿命预测分析

Study on Size Effect of Induction Heatng and Characteristics of Induction Heatng Interconnection Technology for BGA Packaging

电磁感应加热尺寸效应及其BGA封装互连新方法特征研究

Integrated power electronics module based on chip scale packaged power devices

基于芯片尺寸封装功率器件的集成电力电子模块(英文)

a graded change in the magnitude of some physical quantity or dimension.

数量尺寸的级别变化。

middle-of-the-road class

(小客车等的) 中等尺寸级

Mechanism and Process of Cu-Sn Bonding for Wafer Level MEMS Packaging

MEMS圆片级封装用Cu-Sn低温键合机理与工艺研究

End-suction centrifugal pumps--Baseplate and installation dimensions

GB/T5660-1985轴向吸入离心泵底座尺寸和安装尺寸