The microstructure and mechanical properties of in situ A12O3 platelet/Ce-TZP composites were studied.
研究了原位生长Ａｌ２Ｏ３片晶／Ｃｅ－ＴＺＰ复合材料的显微结构与力学性能。
form cobalt hydroxides were synthesized through a controlled crystallization process under the certain mixing intensity, Co 2+ concentration, pH value and the protect of the inert gas and the products was fine platelet powder with high purity and high crystallinity.
通过控制结晶法，在一定的搅拌强度、一定的Ｃｏ２＋ 浓度、一定的ｐＨ值和惰性气体保护的条件下合成出高纯度和高结晶度的β－Ｃｏ（ＯＨ）２ 的片晶细粉。
SiC platelets/C preform was infiltrated with liquid silicon to prepare reaction bonded silicon carbide(RBSC) materials.
以液Si浸渗SiC片晶和C的坯体制备了SiC片晶增韧反应烧结SiC陶瓷材料,讨论了SiC片晶的掺加分数及烧结温度对材料显微结构和力学性能的影响,并比较了所得材料与传统反应烧结材料的力学性能。
Advances in the development of ceramies toughened with whiskers, particles or platelets are reviewed with primary focus on toughening mechanism by crack bridging process-es (e.
讨论了用晶须、颗粒或片晶增韧陶瓷在断裂韧性和强度上的发展。
Double-sided polishing process is a precise machining method for silicon wafers.
晶片在双面抛光加工过程中具有多向运动、受力复杂、表面材料微细去除的特征,晶片的运动和受力是影响双面抛光加工质量的主要因素。
CdSe Detector Wafer Surface Treatment and Passivation Study;
CdSe探测器晶片表面处理和钝化研究
Free-pyro black LiNbO_3 and LiTaO_3 wafers were prepared successfully by chemical reduction at (700 °C) and 450 °C respectively under a mixed atmosphere of CO_2 and H_2.
采用化学还原工艺,在CO2与H2混合气氛下对LN和LT晶片分别进行700°C和450°C退火处理,成功地制备了LN和LT黑色晶片。
The wafer edge grinding technique of the semiconductor technology was discussed,and the feature was analyzed.
对半导体工艺中晶片的边缘磨削技术进行了论述,分析了晶片边缘磨削技术的特点,在此基础上,提出了一种高效、可靠的晶片边缘磨削方法。
Ultra precision-machining technology for crystal wafers;
晶片材料的超精密加工技术现状
The article directly introduced crystal wafer processing and other main parameters through testing diagrams,meanwhile four inch LiNbO3 wafer s reaching level of Ningxia Orient Tantalum Industry.
通过检测图片,直观地介绍了衡量晶片加工水平各主要参数的意义;同时,介绍了宁夏东方钽业4英寸LN(LiNbO3)晶片研发的进展,并和目前国外4英寸LN晶片加工水平进行了对比。
Observation of Banded Spherulites and Lamellar Structures by Atomic Force Microscopy;
原子力显微镜观察环带球晶的形貌和片晶结构
Crystallographic Features Study of Polycrystalline Silicon Ingot for Solar Cells
用于太阳能电池的多晶硅锭片晶体学特征研究
Monocrystalline germanium slices
GB/T15713-1995锗单晶片
Mechanical Test Wafer- A silicon wafer used for testing purposes.
机械测试晶圆片-用于测试的晶圆片。
multicrystal phased array scanning
相控阵多晶片电子扫描
plate form of wax crystals
石蜡结晶的片状结构
polycrystalline diamond compact bit
聚晶金刚石复合片钻头
strontium barium niobate pyroelectric crystal plate
铌酸锶钡热电晶片材料
Molten salt synthesis of platelet NaNbO_3 crystals
熔盐法合成片状NaNbO_3晶体
" Indium antimonide polycrystal, single crystals and as-cut slices"
GB/T11072-1989锑化铟多晶、单晶及切割片
Process Test Wafer- A wafer that can be used for processes as well as area cleanliness.
加工测试晶圆片-用于区域清洁过程中的晶圆片。
Ingot- A cylindrical solid made of polycrystalline or single crystal silicon from which wafers are cut.
晶锭-由多晶或单晶形成的圆柱体，晶圆片由此切割而成。
Monocrystalline silicon ascut slices and lapped slices
GB/T12965-1996硅单晶切割片和研磨片
Others tried stacking conventional 2-D chips on top of one another.
另外有人试著把二维晶片一片片堆叠起来。
Notch- An indent on the edge of a wafer used for orientation purposes.
凹槽-晶圆片边缘上用于晶向定位的小凹槽。
To smooth the surface of a wafer or semiconductor crystal.
使晶片或半导体晶体的表面光滑的过程。
Hydrothermal Synthesis of the Mn_xZn_(1-x)O Crystal and the Crystal Sheet of Nano Boehmite;
水热法合成Mn_xZn_（1-x）O晶体和纳米薄水铝石晶片
EFFECT OF TWIN LAMELLAR THICKNESS ON THE FATIGUE PROPERTIES OF NANO-TWINNED Cu
孪晶片层厚度对纳米孪晶Cu疲劳性能的影响
