The Technology of flexible printed circuit(FPC) has been developed rapidly in recent years.
近年来,挠性印制电路板(FPC)技术发展很快。
3-layer halogen-free FCCL was used to prepare double side FPC.
使用无卤三层法挠性覆铜板(FCCL)制备一款双面挠性印制电路板(FPC),在钻孔、沉镀铜、层压、化学镀金等关键的制程后检测基材的尺寸稳定性,结果表明该无卤FCCL具备优异的尺寸稳定性和可加工性。
The COF FPC production technology at home is in the primary stage of development.
COF挠性印制电路板,作为COF的重要组成部分之一,当前正处于技术和市场都快速增长的态势。
Adhesive coated polyester film for flexible printed circuits
GB/T14708-1993挠性印制电路用涂胶聚酯薄膜
Adhesive coated polyimide film for flexible printed circuits
GB/T14709-1993挠性印制电路用涂胶聚酰亚胺薄膜
Test methods for flexible copper-clad material for printed circuits
GB/T13557-1992印制电路用挠性覆铜箔材料试验方法
Flexible copper-clad polyimide film for printed circuits
GB/T13555-1992印制电路用挠性覆铜箔聚酰亚胺薄膜
Flexible copper-clad polyester film for printed circuits
GB/T13556-1992印制电路用挠性覆铜箔聚脂薄膜
Test method for electrical integrity of printed boards
GB/T4677.19-1988印制板电路完善性测试方法
Recycle of Spent Acidic Etchant for Printed Circuit Board
印制电路板酸性蚀刻废液的回收利用
Effect of ESD on Insulating Characteristic of PCB
ESD对印制电路板绝缘性能的影响
fliexble conduit ,of base metal, not insulated ,for electric wiring
电线挠性导管,贱金属制,不绝缘
Precise Controlling of Resistance and Characteristic Impedance of PCB
印制电路板微电阻及特性阻抗的精度控制
Researches on High Dynamic Application of Flexible Printed Circuits;
挠性电路板在高弯曲应力中的试验研究
Application Study of Coverlayer Cutting with UV Laser
UV激光切割挠性电路覆盖膜的应用研究
Evaluation Model & Knowledge-Base of PCB DFM
印制电路板可制造性设计评价模型与知识库
Potechnics Printed Circuits Ltd.
普迪印制电路有限公司
printed circuit board portable tester
印制电路板袖珍测试器
interlayer contact
层间接触-印制电路板的
interlayer continuity
层间连接-印制电路板的
Performance Test on PCB Surface Coating
印制电路板组件表面三防涂覆材料性能研究