Thermal stress analysis and fatigue life prediction for solder joint of SCSP;
叠层芯片封装元件热应力分析及焊点寿命预测
To solve the problem of high sensitivity to position of component that exists in the algorithms widely used in Automatic Optical Inspection(AOI) for chip component, an automatic optical inspection algorithm is presented.
该文针对片状元件提出一种检测算法,根据元件局部特征区域的灰度变化,通过引入局部主波概率,利用主波特性描述标本图像与被测元件图像之间的相似度,从而判断元件是否存在缺陷并确定缺陷种类。
Study on Protel DXP Packaging Components Library
Protel DXP元件封装库的研究
Development&Application of Tracking Filter Based on Closed-Form Modeling of SMD;
基于贴片元件封装模型的宽范围跟踪滤波网络的设计与应用
Effect of Hydrogen on the Reliability of Microelectronic Devices
氢对金属封装密封元器件可靠性的影响
The FEA Simulation of Moisture Diffusion in Electronic Packages;
塑料电子封装件中湿扩散有限元分析
General specification for electronic components plastic packaging equipments
GB/T13947-1992电子元器件塑料封装设备通用技术条件
FEA Method of High-power Semiconductor Encapsulation
大功率半导体器件封装结构的有限元分析
In relation to an integrated circuit;a term that indicates small element size and high packing density.
集成电路技术中的一种修饰术语，表示元件体积小而且封装密度高。
encapsulated fuel unit
加密封套的燃料元件
Analysis on the Relation between EMC Property and Packaging Defect
浅析环氧塑封料性能与器件封装缺陷
Development of Anti-aging Coating for Rubber Parts of Armored Equipment
装甲装备橡胶密封件抗老化封存膜的研制
This new material provides a main ehannal to solve the heat matching of electronic device package.
它的出现为解决电子元器件的封装热匹配问题提供了一条有效途径。
The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays.
减少元件和电路的几何尺寸，以达到增加电路的封装密度、减少功耗和减小信号传播延迟的目的。
Finite element analysis on soldered joint reliability of QFN device
QFN封装焊点可靠性的有限元分析
Finite Element Analysis on Rubber Sealing Y-ring in the Condition of Static Seal
静密封条件下Y形橡胶密封圈有限元分析
Research on Assembly Reliability and Sealing Properties of the Bearing Sealed Ring;
轴承密封件安装稳定性与密封特性研究
A preassembled unit.
预装件预先组装好的元件
BASIC ELECTRICAL UNITS
基本电气元件和装置
Place the components listed below inside the chamber in the order given.
按如下顺序装配各元件
