A packet listening method,which could reduce route maintenance overhead and route discovery frequency,was studied,then a local route repair and optimization algorithm,which was based on node height and can repair the failure path due to link breakage,was presented.
针对简单泛洪效率低的问题,提出了一个限制洪泛的高效的路由广播算法,通过Euclidean距离来限制路由发现过程中请求分组被转发的次数;研究了减少路由维护开销,并降低路由发现的频率的方法,提出了一个基于节点高度的路由修复与优化算法,该算法使用节点监听来对链路断裂的路由进行修复与优化。
Effect of Stand-off Height on Microstructure and Tensile Strength of Solder Joints
焊点高度对焊点微观组织和抗拉强度的影响
Development of Constant Current Controller with Dual-CPU for Spot Welding;
单片机提高点焊恒流控制精度的探索
Microstructure and property of spot welded joint of ultra-high strength steel and micro-alloy steel
超高强度钢与微合金钢点焊接头的组织与性能
Effect of reflow soldering on IMC and shear strength of SnAgCu solder joint
回流焊对SnAgCu焊点IMC及剪切强度的影响
To solder(two pieces of metal)together using a hard solder with a high melting point.
硬焊用高熔点的硬质焊锡将（两块金属）焊在一起
solder together by using hard solder with a high melting point.
用高熔点的焊料来连接。
solder that contains copper; melts at a relatively high temperature; used for brazing.
含铜的焊料，熔点较高，用于铜焊。
Effects of isothermal aging and joint size on the strength of Sn-3.0Ag-0.5Cu microscale solder joints
热时效和焊点尺寸对SnAgCu微焊点强度的影响
Technology and Simulation of the Temperature Field of High-melting Point Alloys Welded by Friction Stir Welding;
高熔点合金搅拌摩擦焊接工艺研究及温度场模拟
The high-strength copper special alloys for resistance welding
电阻焊专用高强度铜材
Indicates concave, convex or flush welds. Increase height to fit above other weld symbol.
指示凹焊缝、凸焊缝或平焊。增加高度以配合其他焊接符号。
Effect of reflow soldering on the IMC and shear strength of Sn-0.3Ag-0.7Cu-xBi/Cu solder joints
回流焊对SnAgCuBi/Cu焊点IMC及剪切强度的影响
The Development of Metal Powder-cored Wire for Submerged Overlaying with High Hardness and Toughness;
高硬度高韧性耐磨埋弧堆焊用药芯焊丝的研制
What Does the Quality Welding Have to Do Wifh the Width and Height of Pipeline Manual Arc Welding
管道手工电弧焊焊接宽度、高度与焊接质量的关系
Design and Experimental Research of Tools Used in Friction Stir Welding for High Melting Point Materials;
高熔点材料搅拌摩擦焊用焊具设计及试验研究
To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads.
为了获得要求的凸起高度，锡膏在晶片焊盘过焊。
The Temperature Control System in HF Spiral Pipe Mill
高频螺旋焊管焊缝温度的闭环控制系统
The Modelling of Temperature Control by Speed in HF Welding Pipe Process and its Temperature Control System
高频直缝焊管焊接速度控温建模及控温系统
