Si3N4 ceramic is brazed with Ti40Zr25Ni15Cu20 amorphous filler metal,the effect of brazing processing parameter on reaction layer products is discussed.
采用Ti40Zr25Ni15Cu20非晶钎料钎焊Si3N4陶瓷,研究了钎焊工艺参数对连接界面产物的影响。
Si_3N_4 ceramic was brazed with Ti40Zr25Ni15Cu20 amorphous filler metal, the effect of brazing processing parameters on interfacial microstructure and joint strength was discussed.
采用Ti40Zr25Ni15Cu20非晶钎料钎焊Si3N4陶瓷,研究钎焊工艺参数对界面反应层和接头连接强度的影响。
The Research on Properties and Bonding Mechanism of Armorphous Cu-P Filler Metals;
非晶Cu-P钎料的性能及钎焊机理研究
Bonding process of pure copper with amorphous Cu-P interlayer
非晶Cu-P钎料钎焊接头形成过程
The Study on Structural Transition and Diffusing Behaviour of Amorphous Cu-P Filler Metals;
非晶Cu-P钎料钎焊过程的组织转变及扩散行为研究
Study on Brazing of Cemented Carbide to Steel Using Cu-Based Microcrystalline Brazing Alloy Foils;
基于Cu基微晶钎料的硬质合金/钢钎焊试验研究
Characteristics of Amorphous Brazing Ribbon of Cu-P Based Alloy
非晶态铜磷钎料真空钎焊紫铜的性能
Microstructure and Mechanical Property of Joint by Amorphous Fillers
非晶镍基钎料钎焊接头性能及微观组织的研究
Microstructure Transformation during Ramp-up of Weld in Brazing Copper with Cu-P Amorphous Fillers
非晶铜磷钎料升温过程中的组织演变
Study on Amorphous Ni-Cu-P Alloy Chemical Plating for New Type of Ammunition Packaging Material
化学镀非晶态Ni-Cu-P合金镀层作为新型弹药包装材料的耐环境试验研究
A Study on the Active Brazing of AlN to W-Cu Alloy with Ag-Ti_4 Active Filler Alloy
Ag-Ti_4活性钎料钎焊AlN与W-Cu合金研究
Investigation of Mg-Cu(Ni) Bulk Metallic Glasses and Composites;
Mg-Cu（Ni）基非晶合金及复合材料的研究
Research on the Properties and the Interfacial Reactions of Sn-Zn-Cu(Ni) Lead-free Solders;
Sn-Zn-Cu（Ni）无铅钎料及其钎焊接头界面反应研究
Influence of Cu on Properties of Zn-Al Solders for Al/Cu Brazing
Cu元素对铝/铜钎焊用Zn-Al钎料性能的影响
Effect of Cr on Property of Stainless Steel Joint Brazed with Series Ni-P Filler Metal
Cr对Ni-P系钎料钎焊不锈钢接头性能的影响
Research on Compressive Creep Bechavior of the Sn-Cu Lead-free Solder;
Sn-Cu无铅钎料压蠕变性能的研究
Study on Cu-Ag-Si-Ga Series Brazing Filler Alloys with Low Vapour Pressure
Cu-Ag-Si-Ga系低蒸气压钎料合金研究
Composition design and optimization of Cu-Ni-Sn-Ti active filler metal
Cu-Ni-Sn-Ti活性钎料成分设计与优化
Affect of Different Solder on Intension of Cu/W Brazing Joint
不同焊料对Cu/W钎焊接头强度的影响
Regression analysis for Sn-Ag-Bi-Cu lead-free solder conductive properties
Sn-Ag-Bi-Cu无铅钎料导电性能回归分析
