The contact stiffness,hardness and elastic modulus of silicon wafers were continuously measured during the loading por- tion of an indentation test by a nanoindenter apparatus with the continuous stiffness measurement technique.
利用纳米压痕仪通过连续刚度测量法对单晶硅片在压入过程中的接触刚度、硬度、弹性模量进行了连续测量。
The contact pressure distribution between silicon wafer and polishing pad and the effect of the retaining ring on it wer.
为了获得单晶硅片化学机械抛光过程中护环对接触压强分布的影响规律,从有护环化学机械抛光实际出发,建立了抛光过程的接触力学模型和边界条件,利用有限元法对有护环抛光接触状态时的接触压强分布进行了计算和分析,并利用抛光实验对计算获得结果进行了验证。
In order to obtain the effect of carrier film on contact pressure distribution in the chemical-mechanical polishing(CMP) of silicon wafer,a mechanism model and a boundary equation were set up,then the contact pressure distribution was calculated and analyzed by use of finite element method,and the calculated result was verified by polishing experiments.
为了获得单晶硅片化学机械抛光过程中背垫对接触压强分布的影响规律,建立了有背垫抛光过程的接触力学模型和边界条件,利用有限元方法进行了有背垫时的接触压强分布的计算与分析,并利用抛光实验对计算结果进行了验证,获得了硅片与抛光垫的接触表面压强分布形态,以及背垫的物理参数对压强分布的影响规律。
Phase transformations of grinding monocrystalline silicon wafer surfaces;
单晶硅片磨削的表面相变
Study on the Surface Layer Damage of Monocrystalline Silicon Wafer Induced by Ultra-precision Grinding;
单晶硅片超精密磨削加工表面层损伤的研究
Free abrasive wire saw technique is the main method for monocrystalline silicon slicing process.
游离磨料线锯切割技术是目前单晶硅切片的主要加工方法。
A Simulant Experiment Study of the Silicon s Mechanism in the CMP;
单晶硅片CMP磨损机理的模拟试验研究
Material removal characteristic of silicon wafers in chemical mechanical polishing
单晶硅片化学机械抛光材料去除特性
Study on the Surface Layer Damage of Monocrystalline Silicon Wafer Induced by Ultra-precision Grinding;
单晶硅片超精密磨削加工表面层损伤的研究
Experimental Research on Ultra-precision Grinding Technology for Silicon Wafer Thinning
单晶硅片超精密磨削减薄技术试验研究
Study on the Machining Performance of Single Crystal Silicon Wafer Cut by Using Reciprocating Electroplated Diamond Wire Saw
往复式电镀金刚石线锯切割单晶硅片特性研究
Characteristic of Material Removal in Chemical Mechanical Polishing of Silicon Wafer Based on Abrasion Behavior
基于磨损行为的单晶硅片化学机械抛光材料的去除特性
Monocrystalline silicon ascut slices and lapped slices
GB/T12965-1996硅单晶切割片和研磨片
The Czochralski silicon monocrystalline polished wafer with a diameter of eight inches
8英寸直拉硅单晶抛光片
Prediction and Measurement of Subsurface Damage Thickness of Silicon Wafer in Wire Saw Slicing
单晶硅线锯切片亚表层损伤层厚度预测与测量
INFLUENCE OF FIRING PROCESS ON BOW OF THIN MONOCRYSTALLINE SILICON WAFERS FOR SOLAR CELLS
烧结工艺对薄片单晶硅太阳电池弯曲的影响
The Research of Power Quality by Improve the Wafer Efficiency of the Monocrystalline Silicon Solar Cell
单晶硅太阳能电池硅片转换效率提高对并网电能质量的改善
Research on the Laser Slotting on the Single Silicon Slice and Application;
激光在太阳能单晶硅圆片上划槽控制的研究与应用
Monocrystalline germanium slices
GB/T15713-1995锗单晶片
Now people can produce a wafer silicon.
现在人们能够生产一种硅晶薄片。
International Standard - Grain-Oriented Electrical Steel Silicon Steel Sheet for Electrical Use
晶粒取向电器用硅钢片主要工业标准
Crystallographic Features Study of Polycrystalline Silicon Ingot for Solar Cells
用于太阳能电池的多晶硅锭片晶体学特征研究
Research of Nc-Si/c-Si Heterojunction MOSFETs Pressure-magnetic Mutli-sensor;
纳米硅/单晶硅异质结MOSFETs压/磁多功能传感器研究
Selection of the Resistivity of Silion Monocvystalline of High-temperature Silion Power Devices;
高温硅功率器件所用硅单晶电阻率的选取
