Specification of DIP lead frames produced by etching
GB/T15877-1995蚀刻型双列封装引线框架规范
Semiconductor integrated circuits--Specification for stamped lead frames of plastic DIP
GB/T14112-1993半导体集成电路塑料双列封装冲制型引线框架规范
ceramic dual in-line package
陶瓷双列直插式封装
Packages canbe plastic, ceramic, Cer- DIP, or other type.
封装类型可以是塑料型、瓷型、瓷双列直插型或其它类型。
Packages canbe plastic, ceramic, Cer-DIP, or other type.
封装类型可以是塑料型、陶瓷型、陶瓷双列直插型或其它类型。
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
Research on Performance of Dry Gas Seal with Single-row Bidirectional Spiral Grooves
单列双向螺旋槽干气密封的性能研究
Our standard gasket is double jacketed metal.
我们标准的垫圈是双重封装的金属。
Multi-chip Array Combination White Light LED Seal Research
多芯片阵列组合白光LED封装研究
Research on Theoretic Model & Its Package Types of the Bidirectional IGBT
双向IGBT理论模型及其封装形式可行性研究
Application of Modified Bismaleimide Resin in Integrated Circuits Package Substrate
双马来酰亚胺树脂体系在封装基板上的应用
It may be desirable to encapsulate larger sequences of commands.
存在着封装更大规模的命令序列的需求。
Reflow Process Simulation for BGA Package by FEA;
球栅阵列封装中回流焊工艺的有限元模拟
Research on Machine Vision Alignment Technology of Area Array Packaging;
面阵列芯片封装设备中的视觉定位技术
Study on Stress-Strain and Thermal Failure of Ball Grid Array Package
球栅阵列封装的应力应变及热失效研究
Integrated life prediction method of ball grid array soldered joint
球栅阵列封装焊点寿命预测的综合方法
Mechanical property of UV curable adhesive bonding in packaging of fiber array waveguide device
阵列波导器件封装用UV胶粘接力学性能分析
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
再成形(Re-Balled)焊球阵列封装的焊球强度评估
