Technology and applications of lead-free soldering;
无铅焊接技术及其应用设计
Development of new moisture and thermal resistant epoxy compounds used in lead-free soldering;
适应无铅焊接的新型耐湿热环氧树脂的发展趋势
The causes of the PCB popcorn in lead-free soldering are briefly described and analyzed,at the same time,countermeasures are put forward regarding the PCB substrate,PCB manufacturing,soldering process and mois-ture absorption etc.
主要从板材、PCB制程、焊接过程和受潮吸湿等方面论述了无铅焊接爆板产生的原因并提出相应的控制措施。
This paper introduced the working principle,characteristics,development,welding techniques and application of non-electric welding,and analyzed the micro-structure of the welding bead and tensile strength of the non-electric welded joints.
介绍了无电焊接技术的工作原理、特点、发展现状、焊接工艺以及应用状况,分析了无电焊接材料焊缝的组织形貌及焊接接头拉伸强度。
Non-electric welding is a novel efficient technique for emergency maintenance, which utilizes the heat released by self-propagating combustion to join metals without needing any power supply or gas sources.
无电焊接技术是利用自蔓延燃烧放热来实现金属连接的方法,无需任何电源和气源,是应急维修的有效技术手段。
Portable non-electric welding material,named non-electric welding pen,is prepared by utilizing highly-exothermic thermite(CuO+Al)with proper additive powders.
采用高放热性的铝热剂(CuO+Al)并加入适当的添加剂,制备了便携式的无电焊接笔材料,其燃烧速度可控,且具有高的燃烧温度。
Applying adopting solderless joint long rail to rail of quenching car;
无缝焊接长轨在焦炉熄焦车轨道上的应用
The realization of electronic products' lead-free jointing will be the final target.
无铅焊接在电子产品装配中是一项重要的技术,它在电子产品的实验、调试和生产中应用非常广泛,而且工作量相当大。
Investigation on Fabrication of a Low Melting Point Lead-free Sn-Bi-X Solders and Lead-free Soldering Process;
低熔点无铅焊料Sn-Bi-X的研制与无铅焊接工艺研究
Application and Development of Surface Mount Technology;
从有铅向无铅焊接过渡阶段应注意的问题
A: IPC is currently working to revise the specification for inspection of lead-free solder joints.
IPC正在修订关于无铅焊接的质检标准。
Quality problem and solution on lead-free solder was reviewed.
并对无铅焊接特有的质量问题及解决方法进行了评述。
Design and Study on Properties in Sn-Based High Multicomponent Temperature Lead-Free Solders
Sn基多组元高温无铅焊接材料的设计及性能研究
All-in-one complex tip design(70 W heater, sensor tip) has strong heat recovery for leadfree soldering.
一体化复合咀设计(0W发热芯,感温焊咀)强大回热功能,适用于无铅焊接.
It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead-free soldering.
包括背景，焊料，表面镀层，元器件，基板，组装工艺，返工和无铅焊接的可靠性。
Study of the Reliability of Power Device with Lead-free Heat-sink Attachment;
功率器件无铅焊料焊接层可靠性研究
Thermomechanical Fatigue Properties of Lead-Free Solder Joints;
无铅合金钎焊接头热疲劳性能的研究
Research of PBGA Voids in Lead-Free Reflow Process
无铅再流焊接PBGA空洞缺陷研究
Research on the Properties and the Interfacial Reactions of Sn-Zn-Cu(Ni) Lead-free Solders;
Sn-Zn-Cu（Ni）无铅钎料及其钎焊接头界面反应研究
Two Welding and Inspection Methods of Lead-free Pin Components
介绍两种无铅引脚元器件的焊接和检验方法
Research of Lead-Free Wave-Soldering System Based on IPC
基于工控机的无铅波峰焊接机系统的研究
Formation and Evolution of the Microstructures of the Sn-Ag-Zn Solders and the Interfaces with Cu Pad
Sn-Ag-Zn系无铅焊料及其连接界面组织形成与演化规律
Microstructure and Performance of Sn-9Zn Based Lead Free Solder/Cu Solder Joint and Their Interface Region
Sn-9Zn基无铅钎料/Cu钎焊接头及界面区组织性能的研究
Influence of Strain Rate Effect on Behavior of Solder Joints under Drop Impact Loading
应变率效应对无铅焊锡接点跌落冲击力学行为的影响
Properties of Sn-3.0Ag-0.5Cu-xNi lead-free solders and soldering joints
Sn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能
Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
