Comparison between Ultra-fine Pitch QFPs and BGAs and their Future;
超细间距方形扁平封装与球栅阵列封装的比较及其发展趋势
Per customer\'s requirement,the company need to build up the Pb-free packaging capability for the BGA product.
为此,本公司需要建立球栅阵列封装类型产品的无铅封装能力。
Ball grid array(BGA)packaging is widely used in surface mount assembly for its good performance.
球栅阵列封装(BGA)综合性能好,广泛应用于表面贴装。
Reflow Process Simulation for BGA Package by FEA;
球栅阵列封装中回流焊工艺的有限元模拟
Study on Stress-Strain and Thermal Failure of Ball Grid Array Package
球栅阵列封装的应力应变及热失效研究
Integrated life prediction method of ball grid array soldered joint
球栅阵列封装焊点寿命预测的综合方法
Robotics Ball Attachment Workcell for Ball Grid Array Semiconductor Packages;
用于集成电路球栅阵列（BGA）封装的全自动植球机的研制开发
Finite-Element Simulation and Solder Joint Life Predictions for Chip Scale Ball Grid Array Size Package;
球栅阵列尺寸封装的有限元法模拟及焊点的寿命预测分析
FC-BGA Flip-Chip Ball Grid Array
反转芯片球形栅格阵列
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
再成形(Re-Balled)焊球阵列封装的焊球强度评估
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
Multi-chip Array Combination White Light LED Seal Research
多芯片阵列组合白光LED封装研究
Failure Analysis of BGA Lead-free Solder Joints under Drop Impact
跌落碰撞下球栅阵列无铅焊点失效分析
FC-PGA Flip-Chip Pin Grid Array
反转芯片针脚栅格阵列
OPGA Organic Pin Grid Array
有机塑料针型栅格阵列
Research on Machine Vision Alignment Technology of Area Array Packaging;
面阵列芯片封装设备中的视觉定位技术
Mechanical property of UV curable adhesive bonding in packaging of fiber array waveguide device
阵列波导器件封装用UV胶粘接力学性能分析
Elastic-Plastic-Creep Computational Analysis & Reliability Evaluation of Ball Grid Array Solder Joint in Cemaric Quartz Chip (CBGA);
陶瓷芯片球栅阵列（CBGA）焊点弹塑性—蠕变计算分析及可靠度评估
Encapsulation study on fiber Bragg grating for intelligent clothing
智能服装用光纤Bragg光栅的封装研究
Light Source Analysis and Design of Machine-vision for Array Waveguide Bonding
阵列波导器件封装中机器视觉系统的光源分析与设计
Analysis and Design of Quasi-optical Grid Arrays Using EMF Method
准光学栅格振荡器阵列的分析与设计
