In the last few years,inkjet technique has attracted great attention for its use as a form-free fabrication method for building 3-D structure of inorganic materials and combinatorial material chips.
近年来,喷墨制备技术被用于无机材料复杂三维结构无模成型和材料芯片的制备中,受到了国内外研究人员的广泛关注。
The combinatorial material chip approach,which is a method to discover and optimize novel materials,is introduced in this paper,and some examples of the application to the metal materials are given.
介绍了一种快速发现和优化新材料的方法——组合材料芯片技术,并举例说明了其在金属材料研究领域中的应用;同时分析了该方法的先进性和局限性以及应用到金属材料时要解决的主要问题。
In present work, combinatorial material chip approach was used to optimize new phosphors Gd1-xAlO3:Eux3+.
将组合材料芯片技术中梯度组合法应用于新型发光材料Gd1-xAlO3:Eux3+(发光峰主峰位置为615nm,对应Eu5D0→7F2电子跃迁)的激活剂掺杂量优化。
The quaternary discrete combinatorial material chip approach was used to optimize new phosphors Gd_(3(1-x))Al_5O_(12)∶RE_(3X).
将组合材料芯片技术中四元组合法应用于新型发光材料Gd3(1-x)Al5O12∶RE3X的RE激活剂和敏化剂种类优选。
Furthermore, high throughput synthesis is the basic of combinatorial materials science and technology.
组合材料芯片技术是近几年发展起来的一种快速发现、优化和筛选新型功能材料的方法。
Using the combinatorial material chip technology,Zn-Al-Ti thin films with different Ti contents(where the mass fraction of Al to Zn are 55%and 45%,respectively) were synthesized on the low-carbon substrate by an ion beam sputtering method.
应用组合材料芯片技术,以离子束溅射法在低碳钢基片上制备了不同Ti掺杂量的Zn-Al-Ti薄膜(Al和Zn质量分数分别为55%和45%)样品阵列。
The research results about optimization of anti-corrosion zinc-based alloy films by a combinatorial material chip technology in our research group are also reported for a fast screening purpose.
此外还介绍了本课题组近几年来使用组合材料芯片技术快速制备和筛选Zn基耐蚀合金镀层所取得的成果。
Application of Combinatorial Materials Approach for Fast Screening of Zn-A1 Alloy Films
组合材料芯片技术应用及Zn-Al合金镀层材料优选
A semiconductor device with between about100 and1000 gates formed on a single chip of semi-conductor material.
一种半导体器件,具有在单片半导体材料芯片上做成的大约100个到1000个门电路。
"The microchip industry depends on materials that are ultrasmooth and ultraflat," he said.
他说："微芯片的制作必须使用超滑超平的材料.
Progress of Anisotropic Conductive Adhesive for Flip Chip Packaging
倒装芯片封装材料—各向异性导电胶的研究进展
Material Research of Poly(Methyl Methacrylate) in DNA Microarray Fabrication
聚甲基丙烯酸甲酯（PMMA）用于DNA芯片的材料研究
Impact of the chip bonding layer material on the thermal resistance of power LED
芯片键合层材料对功率型LED热阻的影响
"The microchip industry depends on materials that are ultrasmooth and ultraflat," he said. "This was anything but that."
他说："微芯片的制作必须使用超滑超平的材料，而这是鸡毛芯片绝对达不到的。"
Westerners believe taht CMOS chip, new material and manufacture industries are the most important in science development.
西方人认为科技发展中，芯片，新型材料和机械制造是第一位的。
Study on the Controlled-nanopore Glass Powder to the Biochip Carrier Material;
孔径可控纳米多孔玻璃粉生物芯片载体材料的研究
Study on Fabrication Technologies of Microchips Based on Silicon and Glass;
基于硅材料与玻璃的微分析芯片制作技术的研究
Study on the Material Adhesion Removal Mechanism in Chemical Mechanical Polishing of Silicon Wafers
芯片化学机械抛光过程中材料吸附去除机理的研究
Optimization of Condition for Biochip Hybridization Using Cellulose Ester Membrane as A Substrate
以纤维素酯膜作为基底材料进行生物芯片杂交条件的优化
core of plastic insulating material, for electrical windings or bobbins
芯体,塑料绝缘材料制,绕组绕线架用
Processor speeds cannot increase unless manufacturers improve the raw materials used to build the chips.
除非制造商改进用于生产芯片的原材料，否则处理器的速度不可能提高；
The chicken-feather chip is made from soybean resin and feathers crafted into a composite material that looks and feels like silicon.
这种鸡毛芯片是用大豆树脂和鸡毛加工而成的合成材料，看起来摸起来都像硅。
Microchip free flow isoelectric focusing with immobilized pH gradient on monolithic materials
基于固定化pH梯度整体材料的芯片自由流等电聚焦电泳模式的构建
Absorption and Dissipation Properties in Temperature of Industrial Hemp Core Fiber
工业大麻秆芯材料的吸温和散温性能
Research on U-foam Core Material in Heat Forming Process
U型泡沫塑料芯材的热成型工艺研究
