Dynamic Bending Experiment and Numerical Study of Board Level Electronics Package;
板级电子封装动态弯曲实验及其数值模拟
electron gun vacuum lock
电子枪真空密封装置
Study on the Encapsulation of Organic Light-emitting Diode Materials with AAO;
AAO模板封装有机电致发光材料的研究
Application of ESPI in Solder Ball Failure Test on Board-Level BGA Package
ESPI在板级BGA封装器件焊球失效检测中的应用
EM China covers semiconductor manufacturing, packaging, SMT, PCB and related test and measurement equipment and technology.
《电子制造》 重点关注半导体制造与封装、表面贴装技术与印刷线路板及相关的测试与测量技术，
Electrical Simulation Research for IC Package Via
集成电路封装基板过孔电学仿真技术研究
A novel embedded power filter structure research in System-in-Package
系统级封装新型埋入式电源滤波结构的研究
The FEA Simulation of Moisture Diffusion in Electronic Packages;
塑料电子封装件中湿扩散有限元分析
Study on Electroless Ni-P Film Plating in Microelectronic Packaging
微电子封装中化学镀Ni-P薄膜研究
Electron-induced Damage of CMOS with Shielded Packages
屏蔽材料封装CMOS器件的电子辐照损伤
Fundamental Study of Novel Si-Al Electronic Packaging Materials
新型电子封装Si-Al合金的基础研究
The Application of "5S" Activity in Electronic Packaging Industry
“5S”管理在电子封装企业中的应用
Research on EMI Shielding Inside Hybrid Intergrated Power Electronic Module
混合封装电力电子集成模块内电磁干扰的屏蔽
Study on the Reliability of SMT Solder Joint in Electronic Packaging;
电子封装中表面贴装焊点的可靠性研究
Thermal Performance Research on Electronics Packaging Component Based on Flip Bonding;
基于倒装焊接的电子封装器件热性能的研究
Thermal-Mechanical and Hygroscopic Characteristics of Micro-electronic Packaging Polymer and Its Packaging Reliability Study;
微电子封装高聚物热、湿—机械特性及其封装可靠性研究
Design of ATE on digital circuit boards of electronic equipments
电子装备数字电路板自动检测仪设计
The Recent Development of Anisotropic Conductive Adhesive Films for Microelectronic Packaging
微电子封装用各向异性导电胶膜的研究进展
