Effect of Reflowing in Nitrogen Ambient and Compressed Air on Properties of PBGA Assemblies;
保护气氛再流焊对塑料球栅阵列焊点性能的影响
The finite element stress analysis of full-matrix PBGA solder joints,based on finite element method has been carried out with a local temperature load.
建立了完全焊点阵列形式的模型,采用局部温度加载方式,对塑料球栅阵列封装的热应力进行了数值模拟。
It establish two-axis model of full-matrix PBGA solder joints,loading local temperature in the steady condition,thermal stress of plastic ball grid array packaging numerical has been carried out value simulation and ANSYS soft analysis.
芯片面向上的塑料球栅阵列封装在今天是非常流行的,而电子封装使用多种性能各异的材料,由于这些材料的热膨胀系数各不相同,把其组合成一个整体后,在使用过程中当温度变化时,在不同的材料界面会产生热应力。
Reliability test and analysis of 1.27mm pitch plastic ball grid array soldered joint under thermal shock;
热冲击条件下1.27mm引脚间距塑封球栅阵列器件焊点可靠性测试与分析
A typical plastic ball grid array (PBGA) component was selected and the plastic ball grid array packaging was modeled as a tri-layer structure composed of encapsulation, die and substrate.
选取典型的塑封球栅阵列封装器件,将其建模为由封装外壳、硅芯片和基板组成的三层结构,采用粘塑性材料模式描述锡铅钎料的力学本构关系,建立器件的三维有限元模型,通过有限元仿真得到焊点的应力应变分布云图、应力应变回线及关键焊点的应变范围,最后根据基于应变的Engelmaier疲劳模型预测塑封球栅阵列焊点的寿命。
Analysis on Stress and Strain Distribution of SnPb Solder Joint in BGA Package;
球栅阵列封装中SnPb焊点的应力应变分析
Finite Element Analysis of Thermal Induced Damage in Ceramic BGA Devices Featuring Composite Solder Array;
复合球栅阵列CBGA封装器件热循环损伤的有限元模拟
Thermal fatigue life of ceramic ball grid array(CBGA)devices under thermal cycling conditions was presented in-55℃～125℃.
研究了陶瓷球栅阵列(CBGA)器件在-55~125℃温度循环条件下的热疲劳寿命,采用光学显微镜研究了失效试件焊点的失效机制,分析了裂纹萌生和扩展的方式。
It can solve the problems such as inhomogeneous heating of different solder bumps in ball grid array,simultaneous heating of chip and carrier with solder ball,etc.
该方法能够很好地解决由于无铅钎料的应用引起的日益严重的诸多问题,如球栅阵列中各钎料球受热不均匀和芯片基板与钎料球同时受热等。
The plastic ball grid array (PBGA) component test vehicles with different combinations of process parameters were designed based on full factorial experiment.
0mm引脚间距塑封球栅阵列(PBGA)器件测试样件,进行了500h的可靠性热循环试验;基于试验数据进行了极差分析和方差分析;用有限元方法分析了PBGA器件焊点内的应力分布。
<Abstrcat>The orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ball grid array (PBGA) component.
基于正交试验设计法对塑封球栅阵列(PBGA)器件焊点工艺参数与可靠性关系进行了研究。
Reflow Process Simulation for BGA Package by FEA;
球栅阵列封装中回流焊工艺的有限元模拟
Study on Stress-Strain and Thermal Failure of Ball Grid Array Package
球栅阵列封装的应力应变及热失效研究
Integrated life prediction method of ball grid array soldered joint
球栅阵列封装焊点寿命预测的综合方法
Failure Analysis of BGA Lead-free Solder Joints under Drop Impact
跌落碰撞下球栅阵列无铅焊点失效分析
Robotics Ball Attachment Workcell for Ball Grid Array Semiconductor Packages;
用于集成电路球栅阵列（BGA）封装的全自动植球机的研制开发
Elastic-Plastic-Creep Computational Analysis & Reliability Evaluation of Ball Grid Array Solder Joint in Cemaric Quartz Chip (CBGA);
陶瓷芯片球栅阵列（CBGA）焊点弹塑性—蠕变计算分析及可靠度评估
Finite-Element Simulation and Solder Joint Life Predictions for Chip Scale Ball Grid Array Size Package;
球栅阵列尺寸封装的有限元法模拟及焊点的寿命预测分析
FC-BGA Flip-Chip Ball Grid Array
反转芯片球形栅格阵列
FC-PGA Flip-Chip Pin Grid Array
反转芯片针脚栅格阵列
OPGA Organic Pin Grid Array
有机塑料针型栅格阵列
Analysis and Design of Quasi-optical Grid Arrays Using EMF Method
准光学栅格振荡器阵列的分析与设计
Silica-on-Silicon Array Waveguides Gratings;
硅基二氧化硅型阵列波导光栅的研制
Studies on Low-loss Flat-field Arrayed Waveguide Grating;
低损耗平场聚焦阵列波导光栅的研究
A simulation and study on Arrayed Waveguide Grating;
阵列波导光栅（AWG）的仿真与研制
Characteristic Analysis of Transmission for the Arrayed Waveguide Grating Wavelength Division Multiplexer;
阵列波导光栅复用器的传输特性分析
Characteristics and Analysis of Spatial Frequency Domain of Arrayed Waveguide Grating;
阵列波导光栅的空间频域特性与分析
Study on Fiber Grating Sensing Array Tempreture Monitoring On-Line;
光纤光栅传感阵列温度在线监测研究
Influence of crosstalk effect on grating light modulator array
交叉效应对光栅光调制器阵列的影响
