[HT3XBS]Effects of different fruit-retaining reagents upon fruiting on Yunan seedless wampee(Clausena lansium Skeels);
不同类型保果剂对郁南无核黄皮的保果试验初报
To probe into the seedless reason of fruit of the Linyuan 1 seedless wampee,the Linyuan 1 seedless wampee is observed at its flower organs, pollen quantity and degree of satiation, and germination, and compared with the seed wampee.
为了探讨林院 1号无核黄皮果实无籽的原因 ,于 1992年～ 2 0 0 0年在广西大学林学院观察林院 1号无核黄皮的花器、花粉数量及饱满程度、花粉萌发情况 ,并和有核黄皮比较 ;采用随机区组试验设计 ,对林院 1号进行自然授粉、去雄不授粉套袋、去雄后用有核黄皮花粉授粉并套袋的授粉试验 ;观察林院 1号的授粉受精过程。
The Application of Orthogonal Experiment to the Composition Design of Lead-free Brass
正交试验法在无铅黄铜成分设计中的应用
The Research and Development of the Environmental Friendly Unleaded Free-cutting Brass and Its Property Investigation;
环境友好无铅易切削黄铜的开发及性能研究
Leaded brass strips for special purpose
GB/T11089-1989专用铅黄铜带
Chinese art metal
中国工艺品用铅锡黄铜
Leaded brass bar for making needle seat of syringe
GB/T4428-1984铅黄铜针座棒
Brass, copper, stainless steel, bismuth, and lead are all suitable.
黄铜、铜、不锈钢、铋及铅都是适合的。
What bronze uses is not brass,but red copper and the alloy of plumbum and stannic.
青铜所用的不是黄铜，是红铜和铅、锡的合金。
373 Copper, zinc, lead, aluminium, bronze and brass are nonferrous metals or alloys.
铜、锌、铅、铝、青铜和黄铜都是有色金属或合金。
HPb63-0.1 leaded brass tube for air valve mouth applications
GB/T8010-1987气门嘴用HPb63-0.1铅黄铜管
Study of Continuous Extrusion for Brass HPb59-1
铅黄铜HPb59-1连续挤压工艺的研究
Hot Extrusion Process of HPb59-1 Flange with Capsule Method
包套法热挤压铅黄铜HPb59-1法兰工艺
The Microstructure and Mechanical Property of Lead-free Solder/copper Single Crystal Interface;
铜单晶体/无铅焊料的界面组织与性能
Effect of Cu addition on Sn-9Zn lead-free solder properties
添加铜对Sn-9Zn无铅钎料性能的影响
Study on Elements Cu、 Zn in Astragalus and Pb、Cd in Ash Bark with Single-sweep Oscillopolarography
示波极谱法测定黄芪中铜、锌和秦皮中铅、镉
Effect of New Type Copper Alloys Refinement Additive on Modification of Cast Lead Brass
新型铜合金细化添加剂对铸造铅黄铜变质处理效果的影响
Morphology of Lead-free SnAgCu Solder Wetting on Cu with Artifical Non-wetting Zone;
微结构铜基底上无铅SnAgCu焊料润湿的形貌研究
Effect of Cerium on Property and Microstructure for SnAgCu Lead Free Solder;
稀土铈对锡银铜无铅钎料组织性能的影响
